Semi. Global Sourcing Provider
As an innovative supplier, we are committed to providing high-quality, cost-saving semiconductor equipment, materials and consumable through collaboration with customers and global partners.
Mobile and Consumer
Automotive and Mobility
Telecom and Infrastructure
Industrial
Defense and Aerospace
Medical
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DRAM, Nand Flash,CIS
Defect Free, Super Flat Wafer
Si, SiC, Epitaxial Wafer grinding
1. Grinding |
2. Cleaning |
3. Inspection |
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High Precision (Eagle XG) , TGV, MEMS, AR Glass
Structured Wafer |
Patterned Wafer |
MPD &TSD : Near free. BPD : Good level.
| 150mm (6") | 200mm (8") | ||
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| MPD(<0.06) | TED (1,238) | MPD(<0.01) | TED (1,201) |
| TSD (<3) | BPD(<190) | TSD (<3) | BPD(<100) |
Actual BPD <100 (near Seed)
| TSD Density = 402 cm-2 Measured by TAS |
TED Density = 1937 cm-2 Measured by TAS |
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TTV 5μm / LTV 2μm
High Precision (Eagle XG) , TGV, MEMS, AR Glass
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grinding and polishing consumables
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